Search Results - Nydegger, Mirco

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  1. 1
    Micron-scale additive manufacturing of binary and ternary alloys by electrohydrodynamic redox 3D printing

    Micron-scale additive manufacturing of binary and ternary alloys by electrohydrodynamic redox 3D printing by Porenta, Nikolaus, Nydegger, Mirco, Menétrey, Maxence, Hammadi, Souzan, Reiser, Alain, Spolenak, Ralph

    Published in Materials & design
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  2. 2
    Composites of Copper Nanowires in Polyethylene: Preparation and Processing to Materials with NIR Dichroism

    Composites of Copper Nanowires in Polyethylene: Preparation and Processing to Materials with NIR Dichroism by Nydegger, Mirco, Deshmukh, Rupali, Tervoort, Elena, Niederberger, Markus, Caseri, Walter

    Published in ACS omega
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  3. 3
    Additive manufacturing of Zn with submicron resolution and its conversion into Zn/ZnO core-shell structures

    Additive manufacturing of Zn with submicron resolution and its conversion into Zn/ZnO core-shell structures by Nydegger, Mirco, Pruška, Adam, Galinski, Henning, Zenobi, Renato, Reiser, Alain, Spolenak, Ralph

    Published in Nanoscale
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  4. 4
    Direct In‐ and Out‐of‐Plane Writing of Metals on Insulators by Electron‐Beam‐Enabled, Confined Electrodeposition with Submicrometer Feature Size

    Direct In‐ and Out‐of‐Plane Writing of Metals on Insulators by Electron‐Beam‐Enabled, Confined Electrodeposition with Submicrometer Feature Size by Nydegger, Mirco, Wang, Zhu‐Jun, Willinger, Marc Georg, Spolenak, Ralph, Reiser, Alain

    Published in Small methods
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  5. 5
    Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowires

    Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowires by Nydegger, Mirco, Spolenak, Ralph

    Published in arXiv.org
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  6. 6
    Direct in- and out-of-plane writing of metals on insulators by electron-beam-enabled, confined electrodeposition with submicrometer feature size

    Direct in- and out-of-plane writing of metals on insulators by electron-beam-enabled, confined electrodeposition with submicrometer feature size by Nydegger, Mirco, Zhu-Jun, Wang, Willinger, Marc, Spolenak, Ralph, Reiser, Alain

    Published in arXiv.org
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