Modelling and analysis of a magnetic microactuator by de Bhailı́s, D, Murray, C, Duffy, M, Alderman, J, Kelly, G, Ó Mathúna, S.C

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Analysis of the performance of integrated inductors (fabricated in MCM-L technology) in RF amplifier applications by Duffy, M., O'Reilly, S., O'Donnell, T., O Mathuna, S.C.

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Impact of power electronics packaging on the reliability of grid connected photovoltaic converters for outdoor applications by Meinhardt, M, Leonavicius, V, Flannery, J, Ó Mathúna, S.C

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Packaging and integration technologies for future high-frequency power supplies by Mathuna, S.C.O., Byrne, P., Duffy, G., Chen, W., Ludwig, M., O'Donnell, T., McCloskey, P., Duffy, M.

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Analysis of Microinductor Performance in a 20-100 MHz DC/DC Converter by Meere, R., O'Donnell, T., Bergveld, H.J., Ningning Wang, O'Mathuna, S.C.

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Comparison of realization techniques for PFC inductor operating in discontinuous conduction mode by Leonavicius, V., Duffy, M., Boeke, U., Mathuna, S.C.O.

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Electrical performance of microtransformers for DC-DC converter applications by Brunet, M., O'Donnell, T.C., Baud, L., Ningning Wang, O'Brien, J., McCloskey, P., O'Mathuna, S.C.

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Impedance formulas for planar magnetic structures with spiral windings by Hurley, W.G., Duffy, M.C., O'Reilly, S., O'Mathuna, S.C.

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Inductive telemetry of multiple sensor modules by Chevalerias, O., O'Donnell, T., Power, D., O'Donovan, N., Duffy, G., Grant, G., O'Mathuna, S.C.

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Modeling of high-frequency micro-transformers by Ningning Wang, Hauser, H., O'Donnell, T., Brunet, M., McCloskey, P., O'Mathuna, S.C.

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Benchmark of power packaging for DC/DC and AC/DC converters by Cheasty, P., Flannery, J., Meinhardt, M., Alderman, A., O'Mathuna, S.C.

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Thermal characterization of vertical multichip modules MCM-V by Cahill, C., Compagno, A., O'Donovan, J., Slattery, O., O'Mathuna, S.C., Barrett, J., Serthelon, I., Val, C., Tigners, J.-P., Stern, J., Ivey, P., Masgrangeas, M., Coello-Vera, A.

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