Chip complexity requires signal and power integrity by Matsui, N., Divekar, D., Orhanovic, N., Wabuka, H.

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Sl and EMI Analysis of Analog Circuit Board Combination of PEEC and MOR by MATSUI, Norio, DIVEKAR, Dileep, ORHANOVIC, Neven

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Time domain simulation of three dimensional microwave structures by the method of characteristics by Orhanovic, N., Tripathi, V.K.

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FDTD-SPICE analysis of high-speed cells in silicon integrated circuits by Orhanovic, N., Matsui, N.

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Structure decomposition for hybrid analysis of multilayer interconnect systems by Orhanovic, N., Divekar, D., Matsui, N.

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Degradation factors for eye diagrams using FDTD/SPICE by Orhanovic, N., Divekar, D., Matsui, N.

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Time-domain characterization and analysis of dispersive dissipative interconnects by Tripathi, V.K., Orhanovic, N.

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