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Formation of Intermetallic Compounds and Microstructure Evolution due to Isothermal Reactive Diffusion at the Interface Between Solid Co and Liquid Sn
by
Odashima, Noritomo
,
O, Minho
,
Kajihara, Masanori
Published in
Journal of electronic materials
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Journal Of Electronic Materials
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Annealing
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Characterization And Evaluation Of Materials
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Chemistry And Materials Science
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Co-Sn Compound
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Co-Sn System
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Copper
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Diffusion Annealing
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Diffusion Layers
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Electronics And Microelectronics
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Engineering
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Engineering, Electrical & Electronic
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Evolution
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Instrumentation
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Interdiffusion
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Interface Reaction
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Intermetallic Compounds
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Isothermal Annealing
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Materials Science
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Materials Science, Multidisciplinary
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Mechanical Properties
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Springer Nature
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Springerlink Contemporary 1997-Present
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