Search Results - Odashima, Tomo

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  1. 1
    Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

    Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics by Fukushima, Takafumi, Susumago, Yuki, Qian, Zhengyang, Shima, Chidai, Du, Bang, Takahashi, Noriyuki, Nagata, Shuta, Odashima, Tomo, Kino, Hisashi, Tanaka, Tetsu

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  2. 2
    FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display

    FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display by Susumago, Yuki, Odashima, Tomo, Ichikawa, Masatsugu, Hanaoka, Hiroki, Kino, Hisashi, Tanaka, Tetsu, Fukushima, Takafumi

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  3. 3
    Wafer-Level Flexible 3D Corrugated Interconnect Formation for Scalable In-Mold Electronics with Embedded Chiplets

    Wafer-Level Flexible 3D Corrugated Interconnect Formation for Scalable In-Mold Electronics with Embedded Chiplets by Odashima, Tomo, Susumago, Yuki, Nagata, Shuta, Kino, Hisashi, Tanaka, Tetsu, Fukushima, Takafumi

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  4. 4
    Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics

    Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics by Wang, Zhe, Ozawa, Ikumi, Susumago, Yuki, Odashima, Tomo, Takahashi, Noriyuki, Kino, Hisashi, Tanaka, Tetsu, Fukushima, Takafumi

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