Search Results - Onozeki, Hitoshi

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  1. 1
    Electrical Transmission Properties of HBM Interface on 2.1-D System in Package Using Organic Interposer

    Electrical Transmission Properties of HBM Interface on 2.1-D System in Package Using Organic Interposer by Uematsu, Yutaka, Ushifusa, Nobuyuki, Onozeki, Hitoshi

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  2. 2
    Study of Fabrication and Reliability for the extremely large 2.5D advanced Package

    Study of Fabrication and Reliability for the extremely large 2.5D advanced Package by Murai, Kosuke, Onozeki, Hitoshi, Kang, Dongchul, Hirano, Kazue, Mitsukura, Kazuyki

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  3. 3
    Novel Negative-Tone Dry Film Resist and Process for Fine Pitch Copper Wiring with L/S = 1.5/1.5 μm on Build-up Substrate

    Novel Negative-Tone Dry Film Resist and Process for Fine Pitch Copper Wiring with L/S = 1.5/1.5 μm on Build-up Substrate by Togasaki, Kei, Toda, Natsuki, Yoshihara, Kensuke, Kaguchi, Yosuke, Funai, Kanako, Onozeki, Hitoshi, Iwashita, Kenichi

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  4. 4
    Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability

    Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability by Noma, Hirokazu, Takahashi, Masaki, Hatakeyama, Nene, Yanaka, Yuichi, Fukui, Akito, Johno, Keita, Onozeki, Hitoshi

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  5. 5
    High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics

    High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics by Nishida, Masataka, Noma, Hirokazu, Segawa, Kouta, Iwakura, Tetsuro, Yamaguchi, Masaki, Han, Younggun, Onozeki, Hitoshi, Mitsukura, Kazuyuki

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  6. 6
    Highly Productive Solder Interconnect Formation by Bump Stabbing for 3D-TSV Die Stacking

    Highly Productive Solder Interconnect Formation by Bump Stabbing for 3D-TSV Die Stacking by Fukuzumi, Shizu, Onozeki, Hitoshi, Suzuki, Naoya, Nonaka, Toshihisa

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  7. 7
    High Productive 3D Stacking Process "Molded Reflow"

    High Productive 3D Stacking Process "Molded Reflow" by Honda, Kazutaka, Noma, Hirokazu, Onozeki, Hitoshi, Fukuzumi, Shizu, Ozaki, Yoshinobu

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  8. 8
    The new primer with copper foil corresponding to semi-additive process for package substrates

    The new primer with copper foil corresponding to semi-additive process for package substrates by Onozeki, Hitoshi, Inoue, Tsubasa, Yamagishi, Katsuji, Tanabe, Takahiro, Suzuki, Takayuki, Ikeda, Kenichi, Ogawa, Nobuyuki

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  9. 9
    Profile-Free Copper Foil for High-Density Packaging Substrates and High-Frequency Applications

    Profile-Free Copper Foil for High-Density Packaging Substrates and High-Frequency Applications by Ogawa, Nobuyuki, Onozeki, Hitoshi, Moriike, Norio, Tanabe, Takahiro, Kumakura, Toshihisa

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