Search Results - Oparowski, J.M.

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    The effects of processing parameters on the microstructure and properties of sputter-deposited TiW thin film diffusion barriers

    The effects of processing parameters on the microstructure and properties of sputter-deposited TiW thin film diffusion barriers by Oparowski, J.M., Sisson, R.D., Biederman, R.R.

    Published in Thin solid films
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    The Determination of Copper Composition Profiles in Semiconductor Device Aluminum Interconnect Electromigration Test Lines using Electron Probe Microanalysis (EPMA)

    The Determination of Copper Composition Profiles in Semiconductor Device Aluminum Interconnect Electromigration Test Lines using Electron Probe Microanalysis (EPMA) by Oparowski, J.M., Sriram, T.S., Ambrose, V.

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