Search Results - Otiaba, K. C.

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  1. 1
    Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

    Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges by Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O., Amalu, E.H.

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  2. 2
    A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

    A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits by Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C., Takyi, G.

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  3. 3
    Thermal effects of die-attach voids location and style on performance of chip level package

    Thermal effects of die-attach voids location and style on performance of chip level package by Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S., Amalu, E. H., Ekpu, M.

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  4. 4
    Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application

    Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application by Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S., Amalu, E. H.

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  5. 5
    Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device

    Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device by Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Ekpu, M., Adeyemi, J.

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