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Intermetallic Compound Growth and Stress Development in Al-Cu Diffusion Couple
by
Mishler, M.
,
Ouvarov-Bancalero, V.
,
Chae, Seung H.
,
Nguyen, Luu
,
Kim, Choong-Un
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Journal of electronic materials
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Journal Of Electronic Materials
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Subjects
Al Intermetallic
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Al-Cu Interdiffusion
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Aluminum
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1
Characterization And Evaluation Of Materials
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Chemistry And Materials Science
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Copper
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Crack Initiation
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Crack Propagation
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Cu
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Cu Wire Bond
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Diffusion Coating
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Electron Microscopy
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Electronics And Microelectronics
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Engineering
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Engineering, Electrical & Electronic
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Epitaxial Growth
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Instrumentation
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Interdiffusion
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Interface Fracture
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Interface Strain
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Springerlink Contemporary (1997 - Present)
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