Search Results - Ouyang, Yao Tsung

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  1. 1
    Metastable Ge nanocrystalline in SiGe matrix for photodiode

    Metastable Ge nanocrystalline in SiGe matrix for photodiode by Ouyang, Yao-Tsung, Su, Chien-Hao, Chang, Jenq-Yang, Cheng, Shao-Liang, Lin, Po-Chen, Wu, Albert T.

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  2. 2
    Si1−xGex photodiode with segregated Ge nanocrystals

    Si1−xGex photodiode with segregated Ge nanocrystals by Ouyang, Yao-Tsung, Hsieh, Hsien-Chien, Lin, Po-Chen, Tseng, Tsan-Hsien, Ku, Ching-Shun, Lee, Hsin-Yi, Wu, Albert T.

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  3. 3
    Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis

    Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis by Hsu, Hsueh-Hsien, Chiu, Tz-Cheng, Chang, Tao-Chih, Huang, Shin-Yi, Lee, Hsin-Yi, Ku, Ching-Shun, Lin, Yang-Yi, Su, Chien-Hao, Chou, Li-Wei, Ouyang, Yao-Tsung, Huang, YI-Ting, Wu, Albert T.

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  4. 4
    In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates

    In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates by Hsu, Hsueh Hsien, Chen, Hao, Ouyang, Yao Tsung, Chiu, Tz Cheng, Chang, Tao Chih, Lee, Hsin Yi, Ku, Chin Shun, Wu, Albert T.

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  5. 5
    Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-ray Diffraction and Finite-Element Analysis : LEAD-FREE SOLDERS

    Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-ray Diffraction and Finite-Element Analysis : LEAD-FREE SOLDERS by HSU, Hsueh-Hsien, CHIU, Tz-Cheng, HUANG, Yi-Ting, WU, Albert T, CHANG, Tao-Chih, HUANG, Shin-Yi, LEE, Hsin-Yi, KU, Ching-Shun, LIN, Yang-Yi, SU, Chien-Hao, CHOU, Li-Wei, OUYANG, Yao-Tsung

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  6. 6
    10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor

    10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor by Wang, Alice, Tsung-Yao Lin, Shichin Ouyang, Wei-Hung Huang, Jidong Wang, Shu-Hsin Chang, Sheng-Ping Chen, Chun-Hsiung Hu, Tai, Jim C., Koan-Sin Tan, Meng-Nan Tsou, Ming-Hsien Lee, Gammie, Gordon, Chi-Wei Yang, Chih-Chieh Yang, Yeh-Chi Chou, Shih-Hung Lin, Wuan Kuo, Chi-Jui Chung, Lee-Kee Yong, Chia-Wei Wang, Kin Hooi Dia, Cheng-Hsing Chien, You-Ming Tsao, Singh, Nitin Kumar, Lagerquist, Rolf, Chih-Cheng Chen, Uming Ko

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