Search Results - Ovental, Jennifer S

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  1. 1
    Corrosion Protection of Copper Using Al2O3, TiO2, ZnO, HfO2, and ZrO2 Atomic Layer Deposition

    Corrosion Protection of Copper Using Al2O3, TiO2, ZnO, HfO2, and ZrO2 Atomic Layer Deposition by Daubert, James S, Hill, Grant T, Gotsch, Hannah N, Gremaud, Antoine P, Ovental, Jennifer S, Williams, Philip S, Oldham, Christopher J, Parsons, Gregory N

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  2. 2
    Intrinsic limitations of atomic layer deposition for pseudocapacitive metal oxides in porous electrochemical capacitor electrodes

    Intrinsic limitations of atomic layer deposition for pseudocapacitive metal oxides in porous electrochemical capacitor electrodes by Daubert, James S, Wang, Ruocun, Ovental, Jennifer S, Barton, Heather F, Rajagopalan, Ramakrishnan, Augustyn, Veronica, Parsons, Gregory N

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    Corrosion Protection of Copper Using Al 2 O 3 , TiO 2 , ZnO, HfO 2 , and ZrO 2 Atomic Layer Deposition

    Corrosion Protection of Copper Using Al 2 O 3 , TiO 2 , ZnO, HfO 2 , and ZrO 2 Atomic Layer Deposition by Daubert, James S, Hill, Grant T, Gotsch, Hannah N, Gremaud, Antoine P, Ovental, Jennifer S, Williams, Philip S, Oldham, Christopher J, Parsons, Gregory N

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    Modeling and experimental demonstration of high-throughput flow-through spatial atomic layer deposition of Al2O3 coatings on textiles at atmospheric pressure

    Modeling and experimental demonstration of high-throughput flow-through spatial atomic layer deposition of Al2O3 coatings on textiles at atmospheric pressure by Mousa, Moataz Bellah M., Ovental, Jennifer S., Brozena, Alexandra H., Oldham, Christopher J., Parsons, Gregory N.

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  5. 5
    TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays

    TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays by Hicks, Jennifer Ovental, Malta, Dean, Bordelon, David, Richter, Daniel, Hong, Jaesub, Grindlay, Jonathan, Allen, Branden, Violette, Daniel P., Miyasaka, Hiromasa

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  6. 6
    Proof of Concept for Through Silicon Vias (TSVs) in Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors

    Proof of Concept for Through Silicon Vias (TSVs) in Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors by Hong, Jaesub, Grindlay, Jonathan, Allen, Branden, Violette, Daniel P, Miyasaka, Hiromasa, Malta, Dean, Ovental, Jennifer, Bordelon, David, Richter, Daniel

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