Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application by Hwang, J.S., Yim, M.J., Paik, K.W.

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P.8.a.004 Nocturnal eating episodes after taking zolpidem: are they sleep problems or eating problems? by Kim, J.M., Kim, Y.C., Shin, H.B., Lim, W.J., Yun, K.W., Paik, K.W.

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Oxidation Studies on a Cu-Base Leadframe Alloy Between 150°C and 300°C by Cho, S.J, Paik, K.W

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Effect of Mo substitution by W on impact property of heat affected zone in duplex stainless steels by Huh, Mann Joo, Kim, Sang Beom, Paik, Kyung Wook, Kim, Young Gil

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The Effect of High Temperature Deformation Conditions on the Secondary Recrystallization of MA 754 Plate by Lee, Jung-Hoon, Paik, Kyung-Wook, Park, Lee-Ju, Kim, Young-Gil, Tundermann, J.H, deBarbadillo, J.J

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Studies on thin film integral passive components for mixed mode multichip module (MCM) applications by Paik, K.W.

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Study of drop-performance improved lead-free solder by PCB pad finish by Lee, Y.W., Lee, J.H., Moon, J.T., Park, Y.S., Paik, K.W.

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Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature by Nah, J.W., Suh, J.O., Paik, K.W., Tu, K.N.

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Characterization of coined solder bumps on PCB pads by Jae-Woong Nah, Paik, K.W., Won-Hoe Kim, Ki-Rok Hur

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Flip chip assembly on PCB substrates with coined solder bumps by Jae-Woong Nah, Paik, K.W., Soon-Jin Cho, Won-Hoe Kim

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Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability by Kim, H.J., Lee, J.Y., Paik, K.W., Koh, K.W., Won, J.H., Choi, S.H., Lee, J., Moon, J.T., Park, Y.J.

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Study on coined solder bumps on micro-via PCBs by Jae-Woong Nah, Paik, K.W., Won-Hoe Kim, Ki-Rok Hur

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Eutectic Pb/Sn solder bump and under bump metallurgy interfacial reactions and adhesion by Jang, S.-Y., Paik, K.-W.

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Development of three-dimensional memory die stack packages using polymer insulated sidewall technique by Hyoung-Soo Ko, Kim, J.S., Yoon, H.G., Jang, S.Y., Cho, S.D., Paik, K.W.

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A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates by Kim, J.S., Paik, K.W., Seo, H.S.

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To cut or not to cut: a thermomechanical stress analysis of polyimide thin-film on ceramic structures by Pecht, M., Xin Wu, Paik, K.W., Bhandarkar, S.N.

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Studies on the high-temperature superconductor (HTS)/metal/polymer dielectric interconnect structure for packaging applications by Paik, K.W., Mogro-Campero, A.

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Studies on the high temperature superconductor (HTS)/metal/polymer dielectric interconnect structure for packaging applications by Paik, K.W., Mogro-Campero, A.

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Thermo-mechanical stresses in laminated polymer films on silicon substrates by Kim, J.S., Paik, K.W., Oh, S.H., Seo, H.S.

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China preps to expand gas output and distribution amid challenges by PAIK, K.W, LAN, Q

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