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    The effect of FSG stability at high temperature on stress-induced voiding in Cu dual-damascene interconnects

    The effect of FSG stability at high temperature on stress-induced voiding in Cu dual-damascene interconnects by OH, Hyeok-Sang, CHUNG, Juhyuk, LEE, Jung-Woo, KANG, Ki-Ho, PARK, Dea-Gun, HAH, Sangrok, CHO, In-Soo, PARK, Kwang-Myeon

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