Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics by Webb, D.P., Hutt, D.A., Hopkinson, N., Conway, P.P., Palmer, P.J.

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Developments in controlled green-water larval culture technologies for estuarine fishes in Queensland, Australia and elsewhere by Palmer, Paul J., Burke, Michael J., Palmer, Claire J., Burke, John B.

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An analysis of technology trends within the electronics industry by Palmer, P.J, Williams, D.J

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Electromagnetic compatibility performance of large area flexible printed circuit automotive harness by Webb, D P, Jaggernauth, W A, Cottrill, M W C, West, A A, Conway, P P, Palmer, P J

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A software tool for estimation of PCB substrate utilisation efficiency statistics from scanned images by Hyslop, S.M., Palmer, P.J., Whalley, D.C.

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The constraints of vias and layers and their impact on PCB design strategy by Palmer, P.J., Williams, D.J.

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3D micro-fabrication processes: a review by Stokes, C, Palmer, P.J

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A substrateless process for sustainable manufacture of electronic assemblies by Webb, D.P., Hutt, D.A., Whalley, D.C., Palmer, P.J.

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The Bending Stresses in Cantilever Plates by Moiré Fringes by Palmer, P.J

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Integration and Packaging of Microsystems by Polymer Overmoulding by Patrick Webb, D., Hutt, D.A., Hopkinson, N., Palmer, P.J., Conway, P.P.

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A model of the distribution of interconnectivity through multiple system levels and the impact of different design strategies and IP re-use on design effort by Palmer, P.J., Williams, D.J.

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Polymer Overmoulding for Microfluidic Device Packaging and System Integration by Webb, D.P., Hsu, C.C., Hutt, D.A., Hopkinson, N., Conway, P.P., Palmer, P.J.

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Thermo-mechanical modelling of polymer encapsulated electronics by Sarvar, F., Teh, N.J., Whalley, D.C., Huntt, D.A., Palmer, P.J.

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Tools for system specific packaging for electro-mechanical systems by Hyslop, S.M., Palmer, P.J., Williams, D.J.

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Embedding of electronics within thermoplastic polymers using injection moulding technique by Teh, N.J., Prosser, S., Conway, P.P., Palmer, P.J., Kioul, A.

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Overmoulding of Electronics for End of Life Recovery by Hutt, D.A., Nee Joo Teh, Sarvar, F., Whalley, D.C., Palmer, P.J., Anderson, P., Kandasubramanian, B., Morris, P., Prosser, S., O'Brien, P.

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Understanding models of substrate behaviour for the routing of high I/O packages by Palmer, P.J., Williams, D.J.

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Web-based tools in support of life cycle engineering of telecommunications products by Palmer, P.J., Williams, D.J., Dixon, A.C.

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The Bending Stresses in Cantilever Plates by Moiré Fringes: An Experimental Technique giving Directly the Gradient at all Points on a Model's Surface by Palmer, P.J.

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Comprehensive genomic profiling of epithelial ovarian cancer by next generation sequencing-based diagnostic assay reveals new routes to targeted therapies by Ross, J.S, Ali, S.M, Wang, K, Palmer, G, Yelensky, R, Lipson, D, Miller, V.A, Zajchowski, D, Shawver, L.K, Stephens, P.J

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