Search Results - Palmieri, F.W.

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    Durability/reliability of BGA solder joints under vibration environment

    Durability/reliability of BGA solder joints under vibration environment by Wong, T.E., Palmieri, F.W., Reed, B.A., Fenger, H.S., Cohen, H.M., Teshiba, K.T.

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    Under-filled BGA solder joint vibration fatigue damage

    Under-filled BGA solder joint vibration fatigue damage by Wong, T.E., Palmieri, F.W., Fenger, H.S.

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