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The Effect of Increasing Nickel Content on the Microstructure, Hardness, and Corrosion Resistance of the CuFeTiZrNix High-Entropy Alloys
by
Kuo, Po-Cheng
,
Chen, Sin-Yi
,
Yu, William
,
Okumura, Ryo
,
Iikubo, Satoshi
,
Laksono, Andromeda Dwi
,
Yen, Yee-Wen
,
Pasana, Alberto S.
Published in
Materials
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Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples
by
Li, Yu-Chun
,
Chang, Ching-Hsun
,
Pasana, Alberto S.
,
Hsiao, Hsien-Ming
,
Yen, Yee-Wen
Published in
Journal of electronic materials
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Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate
by
Liu, Chia-Yu
,
Kuo, Po-Cheng
,
Chen, Chih-Ming
,
Dai, Jia-Ying
,
Yen, Yee-Wen
,
Pasana, Alberto S.
Published in
Journal of electronic materials
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The Effect of Increasing Nickel Content on the Microstructure, Hardness, and Corrosion Resistance of the CuFeTiZrNi x High-Entropy Alloys
by
Kuo, Po-Cheng
,
Chen, Sin-Yi
,
Yu, William
,
Okumura, Ryo
,
Iikubo, Satoshi
,
Laksono, Andromeda Dwi
,
Yen, Yee-Wen
,
Pasana, Alberto S
Published in
Materials
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