Sapphire Rapids: The Next-Generation Intel Xeon Scalable Processor by Nassif, Nevine, Munch, Ashley O., Molnar, Carleton L., Pasdast, Gerald, Lyer, Sitaraman V., Yang, Zibing, Mendoza, Oscar, Huddart, Mark, Venkataraman, Srikrishnan, Kandula, Sireesha, Marom, Rafi, Kern, Alexandra M., Bowhill, Bill, Mulvihill, David R., Nimmagadda, Srikanth, Kalidindi, Varma, Krause, Jonathan, Haq, Mohammad M., Sharma, Roopali, Duda, Kevin

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Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level by Das Sharma, Debendra, Pasdast, Gerald, Qian, Zhiguo, Aygun, Kemal

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Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors by Elsherbini, Adel, Liff, Shawna, Swan, Johanna, Jun, Kimin, Tiagaraj, Sathya, Pasdast, Gerald

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Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process by Talukdar, Tushar, Elsherbini, Adel, Rawlings, Brandon, Vreeland, Richard, Brezinski, William, Dong, Siyan, Niazi, Haris Khan, Liu, Pilin, Shi, Yi, Tabassum, Natasha, Sathe, Ajay, Ajayi, Taiwo, Bedoya, Felipe, Tiagaraj, Sathya Narasimman, Pasdast, Gerald, Jun, Kimin, Brun, Xavier, Swan, Johanna

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Design of a high speed processor system bus for notebook computers by Pochang Hsu, Yanmei Tian, Pasdast, G.

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