Search Results - Patel, Shabaz Basheer

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    Stress analysis in 3D IC having Thermal Through Silicon Vias (TTSV)

    Stress analysis in 3D IC having Thermal Through Silicon Vias (TTSV) by Patel, Shabaz Basheer, Ghosh, Tamal, Dutta, Asudeb, Singh, Shivgovind

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    Targeted cooling with CVD diamond and micro-channel to meet 3-D IC heat dissipation challenge

    Targeted cooling with CVD diamond and micro-channel to meet 3-D IC heat dissipation challenge by Khan, Aftab Alam, Patel, Shabaz Basheer, Chaturvedi, Divanshu, Dutta, Ashudeb, Singh, Shivgovind

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