Search Results - Paul, Soumya Deep

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  1. 1
    Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates

    Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates by Selbmann, Franz, Paul, Soumya Deep, Satwara, Maulik, Roscher, Frank, Wiemer, Maik, Kuhn, Harald, Joseph, Yvonne

    Published in Micromachines (Basel)
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  2. 2
    Mechanical properties and applications of custom-built gold AFM cantilevers

    Mechanical properties and applications of custom-built gold AFM cantilevers by Kolchuzhin, Vladimir A., Sheremet, Evgeniya, Bhattacharya, Kunal, Rodriguez, Raul D., Paul, Soumya Deep, Mehner, Jan, Hietschold, Michael, Zahn, Dietrich R.T.

    Published in Mechatronics (Oxford)
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  3. 3
    Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices

    Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices by Fettke, Matthias, Kubsch, Timo, Fisch, Anne, Baa, Mohammed Ziad, Teutsch, Thorsten, Seifert, Tobias, Baum, Mario, Selbmann, Franz, Paul, Soumya Deep, Roscher, Frank, Kreyssig, Kerstin, Wiemer, Maik, Kuhn, Harald

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  4. 4
    Silver sintering technology based on induction heating for chip level bonding

    Silver sintering technology based on induction heating for chip level bonding by Hofmann, Christian, Baum, Mario, Satwara, Maulik, Kroll, Martin, Panhale, Sushant, Rochala, Patrick, Paul, Soumya-Deep, Oi, Kiyoshi, Murayama, Kei, Wiemer, Maik, Kuhn, Harald

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