Search Results - Paul-Chang Lin

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  1. 1
    The Effect of Inhibitors on the Electrochemical Deposition of Copper Through-silicon Via and its CMP Process Optimization

    The Effect of Inhibitors on the Electrochemical Deposition of Copper Through-silicon Via and its CMP Process Optimization by Paul-Chang Lin, Jin-Hai Xu, Hong-Liang Lu, David Wei Zhang, Pei Li

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  2. 2
    CMP Slurry and Process Development for TSV Front-Side Polishing

    CMP Slurry and Process Development for TSV Front-Side Polishing by Xu, Jinhai, Lin, Paul-Chang, Li, Pei, Zhu, Tony, Ma, Zhiyong, Chen, Danny, Pang, Keliang, Wang, Xucheng, Wang, Yuchun

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  3. 3
    Effective Approach for TSV Cu Plating Gap Fill Improvement

    Effective Approach for TSV Cu Plating Gap Fill Improvement by Lin, Paul-Chang, Li, Guang-Ning, Jiang, Jian-Yong, He, Peng, Sun, Ri-hui, Yang, Yi, Liu, Xuan-Jie, Chen, Xiao-Jun

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  4. 4
    Study on Defect Reduction and Yield Improvement of MIM Al Deposition Process

    Study on Defect Reduction and Yield Improvement of MIM Al Deposition Process by Chang, Vincent, Gu, Athics, Li, Terry, Zhang, Ji-Wei, Jiang, Jian-Yong, Lin, Paul-Chang

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  5. 5
    Contact Resistance Study in MOCVD TiN Process

    Contact Resistance Study in MOCVD TiN Process by Han, Jerry, Li, Bigtree, Zhang, Ji-Wei, Jiang, Jian-Yong, Lin, Paul-Chang

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  6. 6
    A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13μm CMOS Technology

    A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13μm CMOS Technology by Ning, Grace, Lin, Paulchang, Xing, Charles, Bian, Allen, Zhao, Hong-Bo, Cao, Ya-Lu

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  7. 7
    Improving Copper Interconnect Reliability via Ta/Ti Based Barrier

    Improving Copper Interconnect Reliability via Ta/Ti Based Barrier by Hu, Xiao-Wen, Lin, Paulchang, Ma, Jenny, Jiang, Jian-Yong, He, Peng

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  8. 8
    Study on Al-Ge Bonding and Quality Improvement in CMEMS Process

    Study on Al-Ge Bonding and Quality Improvement in CMEMS Process by Gu, Athics, Lin, Paul-Chang, Chang, Vincent, Li, Terry, Zhang, Ji-Wei, Jiang, Jian-Yong, Xing, Charles

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  9. 9
    Study on the Ring Type Crater Defect Reduction in Cu CMP Process

    Study on the Ring Type Crater Defect Reduction in Cu CMP Process by Xu, Jin-Hai, Lin, Paulchang, Xing, Charles, Li, Pei, Ma, Zhiyong

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  10. 10
    The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects

    The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects by Cao, Ya-Lu, Xing, Charles, Xu, Neil, Zhou, Hua, Bian, Allen, Lin, Paulchang

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  11. 11
    Wafer Backside Arcing Prevention in SIP Ti/TiN Process

    Wafer Backside Arcing Prevention in SIP Ti/TiN Process by Huang, Hupin, Lin, Paul-Chang, Gui, Kun, Wang, William, Li, Terry, Ji, Justin, Jiang, Jian-Yong

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  12. 12
    Effective Approach for Hillock Defect Reduction in Cu Metallization Process

    Effective Approach for Hillock Defect Reduction in Cu Metallization Process by Li, Guang-Ning, Lin, Paul-Chang, Jiang, Jian-Yong, He, Peng, Sun, Ri-Hui, Yang, Yi, Xing, Charles

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  13. 13
    Study on the Solution of via Bottom Void in 90nm Technology

    Study on the Solution of via Bottom Void in 90nm Technology by Zhou, Dong-Yi, He, Peng, Sun, Ri-Hui, Yang, Yi, Kang, Xiao-Chun, Jiang, Jian-Yong, Lin, Paul-Chang

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  14. 14
    Fab Environment Effect on Crescent Pits Defect in Cu Metallization Process

    Fab Environment Effect on Crescent Pits Defect in Cu Metallization Process by Kang, Xiao-Chun, Lin, Paul-Chang, He, Peng, Sun, Ri-Hui, Yang, Yi, Zhou, Dong-Yi, Jiang, Jian-Yong, Xing, Charles

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  15. 15
    Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process

    Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process by Chen, Andy, Bian, Allen, Lin, Paul-Chang, Xing, Charles, Zhou, Hua

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  16. 16
    Novel Approach for W Loss Defect Prevention on WCMP Re-Clean Process

    Novel Approach for W Loss Defect Prevention on WCMP Re-Clean Process by Zhang, Jian, Wang, Zhe, Wen, Jing, Wu, Duan-Yi, Lin, Paul-Chang, Xing, Charles

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  17. 17
    Study of Crater Defect Reduction in Cu Plating Process

    Study of Crater Defect Reduction in Cu Plating Process by Chen, Liang, Wu, Kan, He, Peng, Bian, Yi J., Zhang, Jiwei, Lin, Paul-Chang, Chiu, Wen-Pin, Xing, Cheng

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  18. 18
    WCVD Seam Hole Improvement to Prevent BEOL Copper Diffusion

    WCVD Seam Hole Improvement to Prevent BEOL Copper Diffusion by Li, Xia, Ji, Justin, Ou-Yang, Dong, Jiang, Ronnie, Zhang, Jiwei, Chiu, Robin, Lin, Paul-Chang, Xing, Charles

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  19. 19
    Study on Effects of Slurry Key Factors on Advanced Oxide CMP Performance

    Study on Effects of Slurry Key Factors on Advanced Oxide CMP Performance by Song, Peter, Yao, Daisy, Lee, Leo, Yuan, Gu, Yu, Chris, Xing, Charles, Lin, Paul-Chang, Sun, Tao, Ma, Zhiyong, Zhu, Yefang, Zhang, Chunlei

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  20. 20
    Mechanism and Solution of Isb Failure on Deep Trench DRAM

    Mechanism and Solution of Isb Failure on Deep Trench DRAM by Li, Zhi-Chao, Mo, Ting-Ting, Lin, Yi-Hui, Sun, Peng, Zhang, Jiwei, Chiu, Wen-Pin, Lin, Paul-Chang, Xing, Charles

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