Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects by Pedreira, O. Varela, Croes, K., Lesniewska, A., Wu, C., van der Veen, M. H., de Messemaeker, J., Vandersmissen, K., Jourdan, N., Wen, L. G., Adelmann, C., Briggs, B., Gonzalez, V. Vega, Bömmels, J., Tokei, Zs

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Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials by Wu, C., Li, Y., Leśniewska, A., Varela Pedreira, O., de Marneffe, J.-F., Ciofi, I., Verdonck, P., Baklanov, M. R., Bömmels, J., De Wolf, I., Tőkei, Zs, Croes, K.

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Cu pumping in TSVs: Effect of pre-CMP thermal budget by De Wolf, I., Croes, K., Varela Pedreira, O., Labie, R., Redolfi, A., Van De Peer, M., Vanstreels, K., Okoro, C., Vandevelde, B., Beyne, E.

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A combined modelling approach to design test structures to study thermomigration in Cu interconnects by Ding, Y., Lofrano, M., Varela Pedreira, O., Zahedmanesh, H., Croes, K., De Wolf, I.

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Cobalt and Ruthenium drift in ultra-thin oxides by Tierno, D., Varela Pedreira, O., Wu, C., Jourdan, N., Kljucar, L., Tőkei, Zs, Croes, K.

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Sealing of poly-SiGe surface micromachined cavities for MEMS-above-CMOS applications by González, P, Guo, B, Pedreira, O Varela, Severi, S, De Meyer, K, Witvrouw, A

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De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure by Pedreira, O. Varela, Ding, Y., Coenen, D., Roussel, Ph, Saleh, A., Simons, V., Zahedmanesh, H., Ciofi, I., Croes, K.

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Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters by Ding, Y., Pedreira, O. Varela, Lofrano, M., Zahedmanesh, H., Chavez, T., Farr, H., De Wolf, I., Croes, K.

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First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP by Murdoch, G., O'Toole, M., Marti, G., Pokhrel, A., Tsvetanova, D., Decoster, S., Kundu, S., Oniki, Y., Thiam, A., Le, Q.T., Varela Pedreira, O., Lesniewska, A., Martinez-Alanis, G., Park, S., Tokei, Zs

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Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps by Lesniewska, A., Pedreira, O. Varela, Lofrano, M., Murdoch, G., van der Veen, M., Dangol, A., Horiguchi, N., Tokei, Zs, Croes, K.

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Insights into metal drift induced failure in MOL and BEOL by Wu, C., Pedreira, O. Varela, Lesniewska, A., Li, Y., Ciofi, I., Tokei, Zs, Croes, K.

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Metal reliability mechanisms in Ruthenium interconnects by Pedreira, O. Varela, Stucchi, M., Gupta, A., Gonzalez, V. Vega, van der Veen, M., Lariviere, S., Wilson, C.J., Tokei, Zs, imec, K. Croes

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Impact of oxide liner properties on TSV Cu pumping and TSV stress by De Messemaeker, J., Pedreira, O. Varela, Moussa, A., Nabiollahi, N., Vanstreels, K., Van Huylenbroeck, S., Philipsen, H., Verdonck, P., Vandevelde, B., De Wolf, I., Beyne, E., Croes, K.

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Interconnect metals beyond copper: reliability challenges and opportunities by Croes, K., Adelmann, Ch, Wilson, C.J., Zahedmanesh, H., Pedreira, O. Varela, Wu, C., Lesniewska, A., Oprins, H., Beyne, S., Ciofi, I., Kocaay, D., Stucchi, M., Tokei, Zs

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CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/Low-k interconnects by Jourdan, N., van der Veen, M. H., Vega Gonzalez, V., Croes, K., Lesniewska, A., Varela Pedreira, O., Van Elshocht, S., Bommels, J., Tokei, Zs

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Selective ALD Mo Deposition in 10nm Contacts by van der Veen, Marleen H., Maes, J. W., Pedreira, O. Varela, Zhu, C., Tierno, D., Datta, S., Jourdan, N., Decoster, S., Wu, C., Mousa, M., Byun, Y., Struyf, H., Park, S., Tokei, Z.

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Electromigration and Thermal Storage Study of Barrierless Co Vias by Pedreira, O. Varela, Croes, K., Zahedmanesh, H., Vandersmissen, K., van der Veen, M. H., Gonzalez, V. Vega, Dictus, D., Zhao, L., Kolies, A., Tokei, Zs

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Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects by Gupta, A., Kundu, S., Decoster, S., Sah, K., Delie, G., Truijen, B., Tierno, D., Marti, G., Pedreira, O. Varela, Kenens, B., Hermans, Y., Adelmann, C., de Wachter, B., Ciofi, I., Murdoch, G., Cross, A., Park, S., Tokei, Z.

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Exploring W-Cu hybrid dual damascene metallization for future nodes by van der Veen, Marleen H., Pedreira, O. Varela, Heylen, N., Jourdan, N., Lariviere, S., Park, S., Struyf, H., Tokei, Zs, Lei, W., Pethe, S., Hwang, S., Chen, F., Wu, Z., Machillot, J., Cockburn, A., Jansen, A.

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Assessment of critical Co electromigration parameters by Pedreira, O. Varela, Lofrano, M., Zahedmanesh, H., Roussel, Ph. J., van der Veen, M., Simons, V., Chery, E., Ciofi, I., Croes, K.

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