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Method to increase defect localization success rate on open failure by combining circuit layout analysis with photon emission microscopy
by
Lee Guan Siong
,
Chin, Aaron
,
Chow Fong Ling
,
Pee Kok Keng
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Conference Proceeding
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Conference Proceedings
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Engineering
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Engineering, Electrical & Electronic
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Failure Analysis
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Integrated Circuit Interconnections
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Inverters
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Layout
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Metals
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Microscopy
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Photonics
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Science & Technology
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Ieee Electronic Library (Iel) Conference Proceedings
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