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2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration
by
Chen, Gary Chang-Fu
,
Lau, John H
,
Yang, Channing Cheng-Lin
,
Huang, Jones Yu-Cheng
,
Peng, Andy Yan-Jia
,
Liu, Hsing-Ning
,
Tseng, Tzyy-Jang
,
Li, Ming
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Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film
by
Yang, Channing Cheng-Lin
,
Lau, John H
,
Peng, Andy Yan-Jia
,
Teng, Vincent
,
Chen, Gary Chang-Fu
,
Huang, Jones Yu-Cheng
,
Chen, YH
,
Liu, Hsing-Ning
,
Tseng, Tzyy-Jang
,
Li, Ming
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Conference Proceeding
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Conference Proceedings
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2.3D Ic Integration
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Accumulation
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Ajinomoto Build-Up Film
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Chip-Last
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Electronic Components
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Engineering
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Engineering, Electrical & Electronic
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Fan-Out
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Hybrid Substrate
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Integrated Circuits
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Metals
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Science & Technology
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Technology
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Bonded Joints
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Dielectric Materials
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Dielectrics
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Fanout
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Finite Element Method
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Glass
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Glass Substrates
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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