Search Results - Periyasamy, Mookan

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    Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux™ 81) for high density interconnect applications

    Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux™ 81) for high density interconnect applications by Dunne, Rajiv C., Sitaraman, Suresh K., Luo, Shijian, Rao, Yang, Wong, C. P., Estes, William E., Gonzalez, Ceferino G., Coburn, John C., Periyasamy, Mookan

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  2. 2
    Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications

    Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications by Dunne, R.C., Sitaraman, S.K., Luo, S., Wong, C.P., Estes, W.E., Periyasamy, M., Coburn, J.

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