Search Results - Petranovic, Dusan

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  1. 1
    Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling

    Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling by Yarui Peng, Taigon Song, Petranovic, Dusan, Sung Kyu Lim

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  2. 2
    Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling

    Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling by Yarui Peng, Petranovic, Dusan, Sung Kyu Lim

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  3. 3
    Parasitic Extraction for Heterogeneous Face-to-Face Bonded 3-D ICs

    Parasitic Extraction for Heterogeneous Face-to-Face Bonded 3-D ICs by Yarui Peng, Taigon Song, Petranovic, Dusan, Sung Kyu Lim

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  4. 4
    Loop-based inductance extraction and modeling for multiconductor on-chip interconnects

    Loop-based inductance extraction and modeling for multiconductor on-chip interconnects by Yu, S., Petranovic, D.M., Krishnan, S., Kwyro Lee, Yang, C.Y.

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  5. 5
    Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design

    Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design by Kabir, MD Arafat, Petranovic, Dusan, Peng, Yarui

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  6. 6
    Interdie Coupling Extraction and Physical Design Optimization for Face-to-Face 3-D ICs

    Interdie Coupling Extraction and Physical Design Optimization for Face-to-Face 3-D ICs by Peng, Yarui, Petranovic, Dusan, Samadi, Kambiz, Kamal, Pratyush, Du, Yang, Lim, Sung Kyu

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  7. 7
    Efficient and accurate RIE modeling methodology for BEOL 2.5D parasitic extraction

    Efficient and accurate RIE modeling methodology for BEOL 2.5D parasitic extraction by Karsilayan, Nur Kurt, Falbo, Jim, Petranovic, Dusan

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  8. 8
    A Novel Moment Based Framework for Accurate and Efficient Static Timing Analysis

    A Novel Moment Based Framework for Accurate and Efficient Static Timing Analysis by Shebaita, Ahmed, Das, Debasish, Petranovic, Dusan, Ismail, Yehea

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  9. 9
    On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs

    On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs by Yarui Peng, Taigon Song, Petranovic, Dusan, Sung Kyu Lim

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  10. 10
    Simple and Accurate Models for Capacitance Considering Floating Metal Fill Insertion

    Simple and Accurate Models for Capacitance Considering Floating Metal Fill Insertion by Youngmin Kim, Petranovic, D., Sylvester, D.

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  11. 11
    Electron transport through metal-multiwall carbon nanotube interfaces

    Electron transport through metal-multiwall carbon nanotube interfaces by Quoc Ngo, Petranovic, D., Krishnan, S., Cassell, A.M., Qi Ye, Jun Li, Meyyappan, M., Yang, C.Y.

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  12. 12
    Fast and accurate full-chip extraction and optimization of TSV-to-wire coupling

    Fast and accurate full-chip extraction and optimization of TSV-to-wire coupling by Peng, Yarui, Petranovic, Dusan, Sung Kyu Lim

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  13. 13
    A unified RLC model for high-speed on-chip interconnects

    A unified RLC model for high-speed on-chip interconnects by Sang-Pil Sim, Krishnan, S., Petranovic, D.M., Arora, N.D., Kwyro Lee, Yang, C.Y.

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  14. 14
    A Scalable In-Context Design and Extraction Flow for Heterogeneous 2.5D Chiplet-Package Co-Optimization

    A Scalable In-Context Design and Extraction Flow for Heterogeneous 2.5D Chiplet-Package Co-Optimization by Kabir, MD Arafat, Petranovic, Dusan, Peng, Yarui

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  15. 15
    Chip/package co-analysis and inductance extraction for fan-out wafer-level-packaging

    Chip/package co-analysis and inductance extraction for fan-out wafer-level-packaging by Peng, Yarui, Petranovic, Dusan, Lim, Sung Kyu

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  16. 16
    A novel moment-based methodology for accurate and efficient static timing analysis

    A novel moment-based methodology for accurate and efficient static timing analysis by Shebaita, A., Petranovic, D., Ismail, Y.

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  17. 17
    Finite word-length effects in implementation of distributions for time-frequency signal analysis

    Finite word-length effects in implementation of distributions for time-frequency signal analysis by Ivanovic, V., Stankovic, L., Petranovic, D.

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  18. 18
    Die-to-package coupling extraction for fan-out wafer-level-packaging

    Die-to-package coupling extraction for fan-out wafer-level-packaging by Yarui Peng, Petranovic, Dusan, Sung Kyu Lim

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  19. 19
    MetaCores: design and optimization techniques

    MetaCores: design and optimization techniques by Meguerdichian, Seapahn, Koushanfar, Farinaz, Morge, Advait, Petranovic, Dusan, Potkonjak, Miodrag

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  20. 20
    Importance of volume discretization of single and coupled interconnects

    Importance of volume discretization of single and coupled interconnects by Shebaita, Ahmed, Petranovic, Dusan, Ismail, Yehea

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