Search Results - Philip, Pierre-Emile

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    Advanced Metallizatisn Processes Integration as Manufacturing Worthy Solutions for > 10:1 Aspect Ratio Mid-Process TSV

    Advanced Metallizatisn Processes Integration as Manufacturing Worthy Solutions for > 10:1 Aspect Ratio Mid-Process TSV by Mourier, Thierry, Gottardi, Mathilde, Ribiere, Celine, Minoret, Stephane, Philip, Pierre-Emile, Romero, Gilles

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    Copper Microstructure Optimization for Fine Pitch Low Temperature Cu/SiO2 Hybrid Bonding

    Copper Microstructure Optimization for Fine Pitch Low Temperature Cu/SiO2 Hybrid Bonding by Maubert, Marie, Gottardi, Mathilde, Philip, Pierre-Emile, Fragnaud, Emilie, Romero, Gilles, Cornelis, Arnaud, Hijazi, Hadi, Fournel, Frank, Calvo-Munoz, Maria-Luisa

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