Search Results - Phone Maw, Hla

  • Showing 1 - 3 results of 3
Refine Results
  1. 1
    Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate

    Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate by Zhong, Z.W, Arulvanan, P, Phone Maw, Hla, Lu, C.W.A

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Characterization of SnAgCu and SnPb solder joints on lowtemperature cofired ceramic substrate

    Characterization of SnAgCu and SnPb solder joints on lowtemperature cofired ceramic substrate by Zhong, Z.W., Arulvanan, P., Phone Maw, Hla, Lu, C.W.A.

    Get full text
    Article
    Save to List
    Saved in:
  3. 3
    Micro Embossing of LTCC (Low Temperature Co-fired Ceramic) Green Substrates

    Micro Embossing of LTCC (Low Temperature Co-fired Ceramic) Green Substrates by Maw, H.P., Shi Chee Wai, Tjeung, R.T., Lu Chee Wai, Lok Boon Keng, Shan Xuechuan

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: