Search Results - Pienimaa, Seppo

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    Evaluation of Inkjet Technology for Electronic Packaging and System Integration

    Evaluation of Inkjet Technology for Electronic Packaging and System Integration by Mantysalo, Matti, Mansikkamaki, Pauliina, Miettinen, Jani, Kaija, Kimmo, Pienimaa, Seppo, Ronkka, Risto, Hashizume, Kenichi, Kamigori, Akiko, Matsuba, Yorishige, Oyama, Kenshu, Terada, Nobuto, Saito, Hiroshi, Kuchiki, Mikiharu, Tsubouchi, Mikihiko

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  2. 2
    Stacked modular package

    Stacked modular package by Pienimaa, S.K., Miettinen, J., Ristolainen, E.

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  3. 3
    High-density packaging for mobile terminals

    High-density packaging for mobile terminals by Pienimaa, S.K., Martin, N.I.

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