A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage by Iacovo, Serena, D'have, Koen, Okudur, Oguzhan Orkut, De Vos, Joeri, Uhrmann, Thomas, Plach, Thomas, Conard, Thierry, Meersschaut, Johan, Bex, Pieter, Brems, Steven, Phommahaxay, Alain, Gonzalez, Mario, Witters, Liesbeth, Beyer, Gerald, Beyne, Eric

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Demonstration of a collective hybrid die-to-wafer integration by Suhard, Samuel, Phommahaxay, Alain, Kennes, Koen, Bex, Pieter, Fodor, Ferenc, Liebens, Maarten, Slabbekoorn, John, Miller, Andy, Beyer, Gerald, Beyne, Eric

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Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer by Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bauder, Olga, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Liu, Xiao, Schmidt, Thomas, Beyer, Gerald, Beyne, Eric

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Development of compression molding process for Fan-Out wafer level packaging by Julien, Bertheau, Fabrice F.C., Duval, Tadashi, Kubota, Pieter, Bex, Koen, Kennes, Alain, Phommahaxay, Arnita, Podpod, Eric, Beyne, Andy, Miller, Gerald, Beyer

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Carrier Systems for Collective Die-to-Wafer Bonding by Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Suhard, Samuel, Bex, Pieter, Brems, Steven, Liu, Xiao, Tussing, Sebastian, Beyer, Gerald, Beyne, Eric

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Multi-tier die stacking through collective die-to-wafer hybrid bonding by Kennes, Koen, Lin, Ye, Suhard, Samuel, Bex, Pieter, Cuypers, Dieter H., Guerrero, Alice, Bumueller, Dennis, Phommahaxay, Alain, Beyer, Gerald, Beyne, Eric

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Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm by Lin, Ye, Bex, Pieter, Kennes, Koen, Derakhshandeh, Jaber, Dhakras, Prathamesh, Suhard, Samuel, Gerets, Carine, Dewilde, Sven, Georgieva, Violeta, Jourdain, Anne, Beyer, Gerald, Beyne, Eric

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Acoustic modulation during laser debonding of collective hybrid bonded dies by Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bumueller, Dennis, Suhard, Samuel, Bex, Pieter, Tussing, Sebastian, Liu, Xiao, Beyer, Gerald, Beyne, Eric

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Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems by Phommahaxay, Alain, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Slabbekoorn, John, Inoue, Fumihiro, Peng, Lan, Kennes, Koen, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric

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Thermal Management and Processing Optimization for 3D Multi-layer Stacked ICs by Lofrano, Melina, Cherman, Vladimir, Gerets, Carine, Bex, Pieter, Beyne, Eric

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Demonstration of a collective hybrid die-to-wafer integration using glass carrier by Suhard, Samuel, Kennes, Koen, Bex, Pieter, Jourdain, Anne, Teugels, Lieve, Walsby, Edward, Bolton, Chris, Patel, Jash, Ashraf, Huma, Barnett, Richard, Fodor, Ferenc, Phommahaxay, Alain, La Tulipe, Douglas, Beyer, Gerald, Beyne, Eric

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10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process by Derakhshandeh, Jaber, Capuz, Giovanni, Cherman, Vladimir, Inoue, Fumihiro, De Preter, Inge, Hou, Lin, Bex, Pieter, Gerets, Carine, Duval, Fabrice, Webers, Tomas, Bertheau, Julien, Van Huylenbroeck, Stefaan, Phommahaxay, Alain, Shafahian, Ehsan, Van der Plas, Geert, Beyne, Eric, Miller, Andy, Beyer, Gerald

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Thermal Compression Bonding: Understanding Heat Transfer by in Situ Measurements and Modeling by Bex, Pieter, Teng Wang, Lofrano, Melina, Cherman, Vladimir, Capuz, Giovanni, Sleeckx, Erik, Beyne, Eric

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Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up by Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arnold, Kim

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A High-Bandwidth Fine-Pitch 2.57Tbps/mm In-package Communication Link Achieving 48fJ/bit/mm Efficiency by Pantano, Nicolas, Van der Plas, Geert, Bex, Pieter, Nolmans, Philip, Velenis, Dimitrios, Verhelst, Marian, Beyne, Eric

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A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10\mu \mathrm pitch microbumps by Derakhshandeh, Jaber, Gerets, Carine, Inoue, Fumihiro, Capuz, Giovanni, Cherman, Vladimir, Lofrano, Melina, Hou, Lin, Cochet, Tom, De Preter, Inge, Webers, Tomas, Bex, Pieter, Jamieson, Geraldine, Maehara, Masataka, Shafahian, Ehsan, Bertheau, Julien, Beyne, Eric, La Tulipe, Douglas Charles, Beyer, Gerald, Van der Plas, Geert, Miller, Andy

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Integrated magnetic cores in FOWLP and their applications by Sun, Xiao, Slabbekoorn, John, Velenis, Dimitrios, Bex, Pieter, Duval, Fabrice, Sterken, Tom, Talmelli, Giacomo, de Preter, Inge, Webers, Tomas, Adelmann, Christoph, Miller, Andy, Van der Plas, Geert, Beyne, Eric

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A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP by Phommahaxay, Alain, Potoms, Goedele, Bertheau, Julien, Bex, Pieter, Duval, Fabrice, Podpod, Arnita, Teng Wang, Verbinnen, Greet, Beyer, Gerald, Sleeckx, Erik, Beyne, Eric, Nakamura, Atsushi, Kamochi, Yoshitaka

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3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures by De Preter, Inge, Derakhshandeh, Jaber, Nagano, Fuya, Sharifi, Shamin Houshmand, Hou, Lin, Bex, Pieter, Suhard, Samuel, Shibata, Toshiaki, Oda, Yukinori, Hashimoto, Shigeo, Lieten, Ruben, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric

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Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding by Phommahaxay, A., Jourdain, A., Verbinnen, G., Woitke, T., Bisson, P., Gabriel, M., Spiess, W., Guerrero, A., McCutcheon, J., Puligadda, R., Bex, P., Van den Eede, A., Swinnen, B., Beyer, G., Miller, A., Beyne, E.

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