Search Results - Pitwon, R.

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  1. 1
    Characterization of Quantum Grade Interconnects

    Characterization of Quantum Grade Interconnects by Ferguson, R, Hall, S.R.G, Smith, J, Pitwon, R, Lee, B

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  2. 2
    FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers

    FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers by Pitwon, R. C. A., Kai Wang, Graham-Jones, J., Papakonstantinou, I., Baghsiahi, H., Offrein, B. J., Dangel, R., Milward, D., Selviah, D. R.

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  3. 3
    Low-Cost, Precision, Self-Alignment Technique for Coupling Laser and Photodiode Arrays to Polymer Waveguide Arrays on Multilayer PCBs

    Low-Cost, Precision, Self-Alignment Technique for Coupling Laser and Photodiode Arrays to Polymer Waveguide Arrays on Multilayer PCBs by Papakonstantinou, I., Selviah, D.R., Pitwon, R., Milward, D.

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  4. 4
    Towards European Standards for Quantum Technologies

    Towards European Standards for Quantum Technologies by O van Deventer, Spethmann, N, Loeffler, M, Amoretti, M, van den Brink, R, Bruno, N, Comi, P, Farrugia, N, Gramegna, M, Kassenberg, B, Kozlowski, W, Länger, T, Lindstrom, T, Martin, V, Neumann, N, Papadopoulos, H, Pascazio, S, Peev, M, Pitwon, R, Rol, M A, Traina, P, Venderbosch, P, Wilhelm-Mauch, F K, Jenet, A

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  5. 5
    960 Gb/s optical backplane using embedded polymer waveguides and demonstration in a 12G SAS storage array

    960 Gb/s optical backplane using embedded polymer waveguides and demonstration in a 12G SAS storage array by Schmidtke, K., Flens, F., Worrall, A., Pitwon, R., Betschon, F., Lamprecht, T., Kraehenbuehl, R.

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  6. 6
    Optical Waveguide End Facet Roughness and Optical Coupling Loss

    Optical Waveguide End Facet Roughness and Optical Coupling Loss by Baghsiahi, Hadi, Kai Wang, Kandulski, Witold, Pitwon, Richard C. A., Selviah, David R.

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  7. 7
    Passive assembly of parallel optical devices onto polymer-based optical printed circuit boards

    Passive assembly of parallel optical devices onto polymer-based optical printed circuit boards by Pitwon, Richard C.A., Hopkins, Ken, Milward, Dave, Muggeridge, Malcolm, Selviah, David R., Wang, Kai

    Published in Circuit world
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  8. 8
    Passive assembly of parallel optical devices onto polymerbased optical printed circuit boards

    Passive assembly of parallel optical devices onto polymerbased optical printed circuit boards by Pitwon, Richard C.A., Hopkins, Ken, Milward, Dave, Muggeridge, Malcolm, Selviah, David R., Wang, Kai

    Published in Circuit world
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  9. 9
    Integrated optical and electronic interconnect PCB manufacturing research

    Integrated optical and electronic interconnect PCB manufacturing research by Selviah, David R., Walker, Andy C., Hutt, David A., Wang, Kai, McCarthy, Aongus, Anibal Fernández, F., Papakonstantinou, Ioannis, Baghsiahi, Hadi, Suyal, Himanshu, Taghizadeh, Mohammad, Conway, Paul, Chappell, John, Zakariyah, Shefiu S., Milward, Dave, Pitwon, Richard, Hopkins, Ken, Muggeridge, Malcolm, Rygate, Jeremy, Calver, Jonathan, Kandulski, Witold, Deshazer, David J., Hueston, Karen, Ives, David J., Ferguson, Robert, Harris, Subrena, Hinde, Gary, Cole, Martin, White, Henry, Suyal, Navin, ur Rehman, Habib, Bryson, Chris

    Published in Circuit world
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  10. 10
    Optical 8-channel, 10 Gb/s MT pluggable connector alignment technology for precision coupling of laser and photodiode arrays to polymer waveguide arrays for optical board-to-board interconnects

    Optical 8-channel, 10 Gb/s MT pluggable connector alignment technology for precision coupling of laser and photodiode arrays to polymer waveguide arrays for optical board-to-board... by Papakonstantinou, I., Selviah, D.R., Kai Wang, Pitwon, R.A., Hopkins, K., Milward, D.

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  11. 11
    Market drivers and architectural requirements for backplane inter-connect capacities in Next Generation PON Head-End equipment in the Access Network

    Market drivers and architectural requirements for backplane inter-connect capacities in Next Generation PON Head-End equipment in the Access Network by Dorward, Richard M., Symington, Keith, Brusberg, Lars, Kropp, Jorg R., Miller, Allen, Pitwon, Richard, Whalley, Simon

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