The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures by Che, F.X., Zhu, W.H., Poh, Edith S.W., Zhang, X.W., Zhang, X.R.

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Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition by Che, F. X., Zhu, W. H., Poh, Edith S. W., Zhang, X. R., Zhang, Xiaowu, Chai, T. C., Gao, S.

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Co-design for thermal performance and mechanical reliability of flip chip devices by Siew Hoon Ore, Poh, S W Edith, Zhu, W H, Yuan, W L, Suthiwongsunthorn, Nathapong

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Ag Content Effect on Mechanical Properties of Sn-xAg-0.5Cu Solders by Che, F.X., Poh, E.C., Zhu, W.H., Xiong, B.S.

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Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish by Zhu, W.H., Luhua Xu, Pang, J.H.L., Zhang, X.R., Poh, E., Sun, Y.F., Sun, A.Y.S., Wang, C.K., Tan, H.B.

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Study of five substrate pad finishes for the co-design of solder joint reliability under board-level drop and temperature cycling test conditions by Wei Sun, Zhu, W.H., Poh, E.S.W., Tan, H.B., Gan, R.T.

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Lead-free solder material characterization for thermo-mechanical modeling by Poh, E.S.W., Zhu, W.H., Zhang, X.R., Wang, C.K., Sun, A.Y.S., Tan, H.B.

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