Critical ultra low-k TDDB reliability issues for advanced CMOS technologies by Chen, F., Shinosky, M., Li, B., Gambino, J., Mongeon, S., Pokrinchak, P., Aitken, J., Badami, D., Angyal, M., Achanta, R., Bonilla, G., Yang, G., Liu, P., Li, K., Sudijono, J., Tan, Y., Tang, T.J., Child, C.

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Effect of CoWP cap thickness on via yield and reliability for Cu interconnects with CoWP-only cap process by Gambino, J., Wynne, J., Smith, S., Mongeon, S., Pokrinchak, P., Meatyard, D.

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Stress migration lifetime for Cu interconnects with CoWP-only cap by Gambino, J., Johnson, C., Therrien, J., Hunt, D., Wynne, J., Smith, S., Mongeon, S., Pokrinchak, P., Levin, T.M.

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Stress migration lifetime for Cu interconnects with CoWP-only cap by Gambino, J.P., Johnson, C.L., Therrien, J.E., Hunt, D.B., Wynne, J.E., Smith, S., Mongeon, S.A., Pokrinchak, D.P., Levin, T.M.

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