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Search Results - Polityko, D.D.
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Integration technology parameters for physical design of vertical system-in-package
by
Polityko, D.D.
,
Guttowski, S.
,
Reichl, H.
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Physical design and technology parameters for vertical system-in-package integration
by
Polityko, D.D.
,
Guttowski, S.
,
John, W.
,
Reichl, H.
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Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package Design
by
Maass, U.
,
Polityko, D.D.
,
Richter, C.
,
Ndip, I.
,
Hefer, J.
,
Guttowski, S.
,
Reichl, H.
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Bonding
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Engineering
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Engineering, Electrical & Electronic
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Integrated Circuit Interconnections
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Materials Science
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Materials Science, Multidisciplinary
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Monolithic Integrated Circuits
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Packaging
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Propagation Delay
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Routing
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Science & Technology
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Stacking
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Technology
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Wire
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Wiring
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2.5D 3D Integration
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Chip Stacking
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Design Rules
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Electric Variables
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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