Search Results - Polityko, David

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  1. 1
    A Novel 3D IC Wafer-Level-Package for New Wave MEMS

    A Novel 3D IC Wafer-Level-Package for New Wave MEMS by Che-Hau Huang, Schuler-Wakins, Sebastian, Ying-Te Ou, Yung-Hui Wang, Reichenbach, Ralf, Polityko, David, Hansen, Uwe

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  2. 2
    Integration technology parameters for physical design of vertical system-in-package

    Integration technology parameters for physical design of vertical system-in-package by Polityko, D.D., Guttowski, S., Reichl, H.

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  3. 3
    Technology Aware Modeling of 2.5D-SiP for Automation in Physical Design

    Technology Aware Modeling of 2.5D-SiP for Automation in Physical Design by Richter, Christian, Polityko, David Dimitry, Hefer, Jan, Guttowski, Stephan, Reichl, Herbert, Berger, Martin, Nowak, Uwe, Schroeder, Michael

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    Physical design and technology parameters for vertical system-in-package integration

    Physical design and technology parameters for vertical system-in-package integration by Polityko, D.D., Guttowski, S., John, W., Reichl, H.

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  5. 5
    Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package Design

    Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package Design by Maass, U., Polityko, D.D., Richter, C., Ndip, I., Hefer, J., Guttowski, S., Reichl, H.

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