Search Results - Pradeep, Yelehanka

  • Showing 1 - 10 results of 10
Refine Results
  1. 1
    S -Band Micromechanical Resonant Impedance Transformers Based on Aluminum Nitride FBARs

    S -Band Micromechanical Resonant Impedance Transformers Based on Aluminum Nitride FBARs by Huang, Yan-Ming, Chang, Chin-Yu, Hsu, Tzu-Hsuan, Ho, Yenshih, Chen, Yung-Hsiang, Pradeep, Yelehanka R., Chand, Rakesh, Li, Sheng-Shian, Fang, Weileun, Li, Ming-Huang

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    S-band High Passive Gain Resonant Transformers Based on Aluminum Nitride FBAR Resonators

    S-band High Passive Gain Resonant Transformers Based on Aluminum Nitride FBAR Resonators by Huang, Yan-Ming, Chang, Chin- Yu, Hsu, Tzu-Hsuan, Ho, Yens, Chen, Yung-Hsiang, Pradeep, Yelehanka R., Chand, Rakesh, Li, Sheng-Shian, Fang, Weileun, Li, Ming-Huang

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  3. 3
    An 8-inch commercial aluminum nitride MEMS platform for the co-existence of Lamb wave and film bulk acoustic wave resonators

    An 8-inch commercial aluminum nitride MEMS platform for the co-existence of Lamb wave and film bulk acoustic wave resonators by Hsu, Tzu-Hsuan, Tung, Shao-Siang, Huang, Yan-Ming, Wu, Guan-Lin, Chang, Chin-Yu, Ho, Yens, Chen, Yung-Hsiang, Pradeep, Yelehanka, Chand, Rakesh, Li, Ming-Huang

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  4. 4
    Wafer level microarcing model in 90nm chemical-vapor deposition low-k via etch on 300mm silicon-on-insulator substrate

    Wafer level microarcing model in 90nm chemical-vapor deposition low-k via etch on 300mm silicon-on-insulator substrate by Cong, Hai, Low, Chun Hui, Pradeep, Yelehanka Ramachandramurthy, Zhang, Xin, Chandima, Perera, Liu, Wu Ping, Tan, Juan Boon, Hsia, Liang Choo

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  5. 5
    Suppression of Spurious Modes in Aluminum Nitride S1 Lamb Wave Resonators Using A Mechanical Soft-Contact Scheme

    Suppression of Spurious Modes in Aluminum Nitride S1 Lamb Wave Resonators Using A Mechanical Soft-Contact Scheme by Tung, Shao-Siang, Hsu, Tzu-Hsuan, Ho, Yens, Chen, Yung-Hsiang, Pradeep, Yelehanka R., Chand, Rakesh, Li, Ming-Huang

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    Wafer level microarcing model in 90 nm chemical-vapor deposition low- k via etch on 300 mm silicon-on-insulator substrate

    Wafer level microarcing model in 90 nm chemical-vapor deposition low- k via etch on 300 mm silicon-on-insulator substrate by Cong, Hai, Low, Chun Hui, Pradeep, Yelehanka Ramachandramurthy, Zhang, Xin, Chandima, Perera, Liu, Wu Ping, Tan, Juan Boon, Hsia, Liang Choo

    Get full text
    Items that this one cites
    Article
    Save to List
    Saved in:
  7. 7
    Study on the Spurious Modes in FBAR Resonators with Quasi-Free Edges

    Study on the Spurious Modes in FBAR Resonators with Quasi-Free Edges by Chang, Chin-Yu, Huang, Yan-Ming, Hsu, Tzu-Hsuan, Chen, Yung-Hsiang, Chand, Rakesh, Pradeep, Yelehanka Ramachandramurthy, Ho, Yens, Li, Ming-Huang, Fang, Weileun, Li, Sheng-Shian

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    Pad etch optimization to minimize polymer

    Pad etch optimization to minimize polymer by Bu, Xiaomei, Luo, Meng, Sin, ChianYuh, Zhang, Fan, Yelehanka, Pradeep, Jong Lee, Tae, Krishnamoorthy, Ahila

    Get full text
    Items that this one cites
    Article
    Save to List
    Saved in:
  9. 9
    Sub-0.1 /spl mu/m MOSFET fabrication using 248 nm lithography by resist trimming technique in high density plasmas

    Sub-0.1 /spl mu/m MOSFET fabrication using 248 nm lithography by resist trimming technique in high density plasmas by Chian-Yuh Sin, Loh Wei Loong, Bing-Hung Chen, Yujie, Pradeep Yelehanka, Lap Chan

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  10. 10
    A novel approach for dual damascene trench etch for 90nm low-K interconnect with no middle etch stop layer

    A novel approach for dual damascene trench etch for 90nm low-K interconnect with no middle etch stop layer by CHEN, Tong Qing, CONG, Hai, LIU, Wu Ping, SIEW, Yong Kong, PRADEEP, Yelehanka, HSIA, Liang Choo, JAISWAL, Rakesh, JAIN, Alok, SIM, Ivan

    Get full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: