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A Methodology to Integrate Thermo-Mechanical Reliability Predictions into Co-design of Flip-Chip-On-Lead Devices
by
Gurrum, Siva
,
Prakuzhy, Manu
,
Guangxu Li
,
Hung-Yun Lin
,
Gandhi, Saumya
,
Arroyo, J. Carlos
,
Mortan, Frank
,
Nangia, Amit
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Conference Proceedings
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Advanced Flip-Chip
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Engineering
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Engineering, Electrical & Electronic
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Geometry
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Interconnect Reliability In Flip Chip
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Lead
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Plastics
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Reliability
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Reliability/Life Test Methods & Models
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Science & Technology
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Silicon
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Soldering
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Stress
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Technology
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Ieee Electronic Library (Iel) Conference Proceedings
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