Search Results - Puligadda, Rama

  • Showing 1 - 12 results of 12
Refine Results
  1. 1
    Understanding deviations in lithographic patterns near interfaces: Characterization of bottom anti-reflective coatings (BARC) and the BARC–resist interface

    Understanding deviations in lithographic patterns near interfaces: Characterization of bottom anti-reflective coatings (BARC) and the BARC–resist interface by Lenhart, Joseph L., Fischer, Daniel, Sambasivan, Sharadha, Lin, Eric K., Wu, Wen-Li, Guerrero, Douglas J., Wang, Yubao, Puligadda, Rama

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Photoactive Polyesters Containing o-Nitro Benzyl Ester Functionality for Photodeactivatable Adhesion

    Photoactive Polyesters Containing o-Nitro Benzyl Ester Functionality for Photodeactivatable Adhesion by June, Stephen M., Suga, Takeo, Heath, William H., Lin, Qin, Puligadda, Rama, Yan, Lei, Dillard, David, Long, Timothy E.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  3. 3
    Edge Protection of Temporarily Bonded Wafers during Backgrinding

    Edge Protection of Temporarily Bonded Wafers during Backgrinding by Bai, Dongshun, Zhong, Xing-Fu, Puligadda, Rama, Burggraf, Jurgen, Burgstaller, Daniel, Lypka, Chris, Verzosa, James

    Get full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  4. 4
    A Single-Layer Mechanical Debonding Adhesive for Advanced Wafer-Level Packaging

    A Single-Layer Mechanical Debonding Adhesive for Advanced Wafer-Level Packaging by Liu, Xiao, Wang, Yubao, Blumenshine, Debbie, Dong, Mei, Puligadda, Rama

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  5. 5
    Recent Progress in Organic Bottom Anti-reflective Coatings

    Recent Progress in Organic Bottom Anti-reflective Coatings by Shao, Xie, Meador, Jim, Deshpande, Shree, Puligadda, Rama, Mizusawa, Kenichi, Arase, Shinya

    Get full text
    Items that cite this one
    Article
    Save to List
    Saved in:
  6. 6
    Photo-Reactive Polyimides and Poly(siloxane imide)s as Reversible Polymeric Interfaces

    Photo-Reactive Polyimides and Poly(siloxane imide)s as Reversible Polymeric Interfaces by June, Stephen M., Suga, Takeo, Heath, William H., Long, Timothy E., Lin, Qin, Puligadda, Rama

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  7. 7
    Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging

    Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging by Hong Zhang, Xiao Liu, Rickard, Shawna, Puligadda, Rama, Flaim, Tony

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    A Versatile Fan-Out Infrastructure Based on Die-Stencil Substrate Promoted by an Advanced Multifunctional Temporary Bonding Material

    A Versatile Fan-Out Infrastructure Based on Die-Stencil Substrate Promoted by an Advanced Multifunctional Temporary Bonding Material by Liu, Xiao, Huang, Baron, Zhang, Hong, Kirchner, Lisa, Southard, Arthur, Puligadda, Rama, Flaim, Tony

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  9. 9
    Near edge x-ray absorption fine structure measurements of the interface between bottom antireflective coatings and a model deprotected photoresist

    Near edge x-ray absorption fine structure measurements of the interface between bottom antireflective coatings and a model deprotected photoresist by Jablonski, Erin L., Sambasivan, Sharadha, Lin, Eric K., Fischer, Daniel A., Devadoss, Chelladurai, Puligadda, Rama

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  10. 10
    Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

    Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding by Phommahaxay, A., Jourdain, A., Verbinnen, G., Woitke, T., Bisson, P., Gabriel, M., Spiess, W., Guerrero, A., McCutcheon, J., Puligadda, R., Bex, P., Van den Eede, A., Swinnen, B., Beyer, G., Miller, A., Beyne, E.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  11. 11
    Process characterization of thin wafer debonding with thermoplastic materials

    Process characterization of thin wafer debonding with thermoplastic materials by Phommahaxay, Alain, Jourdain, Anne, Verbinnen, Greet, Woitke, Tobias, Stieber, Ralf, Bisson, Peter, Gabriel, Markus, Spiess, Walter, Guerrero, Alice, McCutcheon, Jeremy, Puligadda, Rama, Bex, Pieter, Van den Eede, Axel, Swinnen, Bart, Beyer, Gerald, Miller, Andy, Beyne, Eric

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  12. 12
    Handover Approach for Heterogeneous Networks with Improved K-Partite Graph

    Handover Approach for Heterogeneous Networks with Improved K-Partite Graph by Puligadda, Jyothi, Kolipaka, Venkata Rama Rao, V., Murali Mohan, Talasila, Vamsidhar

    Get full text
    Items that this one cites
    Article
    Save to List
    Saved in:

Search Tools: