Search Results - REBIBIS, Kenneth J

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  1. 1
    The Increasing Role of Polymers in Advanced Packaging - From Stress Buffer Layers to Wafer Level Underfills and Beyond

    The Increasing Role of Polymers in Advanced Packaging - From Stress Buffer Layers to Wafer Level Underfills and Beyond by Miller, Andy, Rebibis, Kenneth J., Duval, Fabrice D. D., Wang, Teng, Slabbekoorn, John, Vos, Joeri De, Beyne, Eric

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  2. 2
    Development of a new improved high performance flip chip BGA package

    Development of a new improved high performance flip chip BGA package by CHONG, Desmond Y. R, LIM, B. K, REBIBIS, Kenneth J, PAN, S. J, KRISHNAMOORTHI, S, KAPOOR, R, SUN, Anthony Y. S, TAN, H. B

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  3. 3
    Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

    Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package by Chong, D.Y.R., Lim, B.K., Rebibis, K.J., Pan, S.J., Sivalingam, K., Kapoor, R., Sun, A.Y.S., Tan, H.B.

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  4. 4
    Evaluation of Mechanical Stress Induced During IC Packaging

    Evaluation of Mechanical Stress Induced During IC Packaging by Cherman, V., Lofrano, M., Gonzalez, M., Cadacio, F., Rebibis, K. J., Beyne, E., Takano, A., Higashi, M.

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