Search Results - Rahiman, W. Y.

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  1. 1
    Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging

    Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging by Majid, M. F. M. A., Khor, C. Y., Abdullah, M. K., Abdullah, M. Z., Rahiman, W. Y., Jappar, A., Aris, M. S.

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    Forward problem studies of electrical resistance tomography system on concrete materials

    Forward problem studies of electrical resistance tomography system on concrete materials by Ang, Vernoon, Rahiman, M. H. F., Rahim, R. A., Aw, S. R., Wahab, Y. A., T., Thomas W. K., Siow, L. T.

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