Search Results - Rajagopalan, Balajee

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  1. 1
    Yield improvement in 2x node technology by introducing backside cleaning

    Yield improvement in 2x node technology by introducing backside cleaning by Garg, Niti, Rajagopalan, Balajee, Scott, Silas, Hoech, Raita

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  2. 2
    Line end voids defectivity improvement on 64 pitch Cu wire interconnects of 14 nm technology

    Line end voids defectivity improvement on 64 pitch Cu wire interconnects of 14 nm technology by Daino, Michael, Jensen, Graham, Jain, Ankit, Kini, Sumanth, Bawari, Atul, Rajagopalan, Balajee, Aizawa, Hirokazu, Jae Choo, Srivastava, Amit, Tolle, Ian, Huang, Ronald, Shiran Xiao, Hoang Nguyen

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  3. 3
    Optimizing Cu barrier thickness for interconnects performance, reliability and yield

    Optimizing Cu barrier thickness for interconnects performance, reliability and yield by Tian Shen, Rajagopalan, Balajee, Silvestre, Mary Claire, Ramanathan, Eswar, Mahalingam, Anbu Selvam K. M., Wenyi Zhang, Kong Boon Yeap, Justison, Patrick

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  4. 4
    Extra-pattern killer defectivity improvement and enhancement of within-feature barrier coverage by optimization of TaN barrier PVD process in 90p Cu wire interconnects for 28nm technology

    Extra-pattern killer defectivity improvement and enhancement of within-feature barrier coverage by optimization of TaN barrier PVD process in 90p Cu wire interconnects for 28nm tec... by Rajagopalan, Balajee, Laloe, Jean-Baptiste, Silvestre, Mary Claire, Ramanathan, Eswar, Khanal, Sohana, Laval, Alain, Ge, Qian, Takahashi, Nobuyuki, Mahalingam, Anbu Selvam, Liew, San Leong, Teagle, Robert

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  5. 5
    A study on the interaction between barrier and plating causing edge stringer defects in 28nm

    A study on the interaction between barrier and plating causing edge stringer defects in 28nm by Ramanathan, Eswar, Smith, Frank, Fiacco, Antonio, Silvestre, Mary Claire, Parks, Val, Rajagopalan, Balajee, Scott, Hildreth, Barker, John, Riendeau, Jeffrey, Laloe, Jean-Baptiste

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