Search Results - Ramashastry, Venkatesh

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  1. 1
    Signal, Power and Thermal Co-Simulation Approach to Validate Interconnects on IC Package and System Board

    Signal, Power and Thermal Co-Simulation Approach to Validate Interconnects on IC Package and System Board by Jagadeesh, Rajesh Badala, Ramashastry, Venkatesh, Ramprasad, Bharath, Rao Bengaluru Srihari, Surya Prakash, Bhat, Satvik

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  2. 2
    Simulation vs Measurement: Comparing PCB design simulations data with the board measured data, importance of the modeling accuracy for better corelation at multi GHz frequencies

    Simulation vs Measurement: Comparing PCB design simulations data with the board measured data, importance of the modeling accuracy for better corelation at multi GHz frequencies by Jagadeesh, Rajesh Badala, Ramashastry, Venkatesh, Ramprasad, Bharath, Srihari, Surya Prakash Rao Bengaluru, Srinivas, Pavan Gulur

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    IC Package with the system board Interconnects - simulation showing PDN noise due to simultaneous switching IOs and its effect on Signal Integrity

    IC Package with the system board Interconnects - simulation showing PDN noise due to simultaneous switching IOs and its effect on Signal Integrity by Jagadeesh, Rajesh Badala, Ramashastry, Venkatesh, Ramprasad, Bharath, Srihari, Surya Prakash Rao Bengaluru, Bhat, Satvik, Radhakrishna, Vignesh Sunku

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