A New Dice Bonding Method for Hybrid Technology by Ramy, J.P, Demeure, L

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New Low Cost Substrate (Duroid) for Hybrid Microwave Integrated Circuits (MICs) in Wide Band by Ramy, J.P, Guena, J, Thebault, C

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New Low Cost Substrate Duroid for Hybrid Microwave Integrated Circuits MICs in Wide Band by Ramy, J.P., Guena, J., Thebault, C.

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Wide band mhmic microstrip technology for optoelectronic uses by Ramy, J.P., Julien, M.P., La Maguer, T., Le Rouzic, J., Pedrono, N., Regreny, O.

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Lgt processing is an essential step in Streptococcus suis lipoprotein mediated innate immune activation by Wichgers, P.J, Rebel, J.M.J, Smits, M.A, Putten, J.P. van, Smith, H.E

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Resolution of Hairy Cell Leukemia Minimal Residual Disease by Both BRAF and Clone-Specific Real-Time Quantitative PCR (RQ-PCR) After Treatment with Moxetumomab Pasudotox by Kreitman, Robert J., Arons, Evgeny, Jeffrey, Sapolsky, Roth, Laura, Zhou, Hong, Stetler-Stevenson, Maryalice, Wilson, Wyndham H., Raffeld, Mark, FitzGerald, David J.P., Fei, Ji, Ibrahim, Ramy, Pastan, Ira

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Optimization of the Thick-and Thin-Film Technologies for Microwave Circuits on Alumina and Fused Silica Substrates by Ramy, J.-P., Cotte, M.-T., Bolloch, J.P., Schnitzler, R., Guena, J.-J., Thebault, C.

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Contributors, Oct. 1978 by Bolloch, J.P., Carlson, E.R., Yu-Wen Chang, Jr, Coleman, D.J., Cotte, M.-T., Doerbeck, F.H., Freibergs, E., Gibson, M.H., Gopinath, A., Guena, J.-J., Gupta, C., Gupta, K.C., Hebert, A.S., Hirayama, M., Horn, R.E., Itanami, T., Itoh, T., Jacobs, H., Kajfez, D., Kamihashi, S., Klohn, K.L., Konishi, Y., Knerr, R.H., McMaster, T.F., Meier, P.J., Neale, B.M., Paul, J.A., Paunovic, Z., Pavlin, S., Pintzos, S.G., Pregla, R., Presser, A., Ramy, J.-P., Rozzi, T.E., Schneider, M.V., Schnitzler, R., Shamasundara, S.D., Shaw, D.W., Shindo, S., Solbach, K., Tajima, Y., Takada, T., Thebault, C., Thomson, I., Hua Quen Tserng, Wisseman, W.R.

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