Research on the development methodology for clinical practice guidelines for organic integration of traditional Chinese and Western medicine by Jin, Ying-Hui, Wang, Yan-Ping, Xie, Ying-Lan, Tian, Gui-Hua, Zhang, Xiao-Yu, Shi, Nan-Nan, Yang, Ke-Hu, Sun, Xin, Chen, Yao-Long, Wu, Da-Rong, Guo, Xin-Feng, Ge, Long, Zhao, Chen, Lu, Cheng, Jiang, Yin, Guo, Jing, Yan, Si-Yu, Wang, Yong-Bo, Huang, Qiao, Ren, Xiang-Ying, Rao, Ying-Yue, Wang, Yun-Yun, Yuan, Meng-Qian, Zeng, Xian-Tao, Shang, Hong-Cai

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Diversity and function of rhizosphere microorganisms between wild and cultivated medicinal plant Glycyrrhiza uralensis Fisch under different soil conditions by Dong, Zhou-Yan, Rao, Manik Prabhu Narsing, Liao, Tian-Jiang, Li, Li, Liu, Yong-Hong, Xiao, Min, Mohamad, Osama Abdalla Abdelshafy, Tian, Yue-Ying, Li, Wen-Jun

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Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer by Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y

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Design, assembly and reliability of large die and fine-pitch Cu/low- k flip chip package by Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun

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Development of Large Die Fine-Pitch Cu/Low-[Formula Omitted] FCBGA Package With Through Silicon via (TSV) Interposer by Chai, Tai Chong, Zhang, Xiaowu, Lau, John H, Selvanayagam, Cheryl S, Damaruganath, Pinjala, Hoe, Yen Yi Germaine, Ong, Yue Ying, Rao, Vempati Srinivas, Wai, Eva, Li, Hong Yu, Liao, E. Bin, Ranganathan, Nagarajan, Vaidyanathan, Kripesh, Liu, Shiguo, Sun, Jiangyan, Ravi, Mullapudi, Vath, Charles J, Tsutsumi, Yoshihiro

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Familial aggregation analysis of gene expressions by Rao, Shao-Qi, Xu, Liang-De, Zhang, Guang-Mei, Li, Xia, Li, Lin, Shen, Gong-Qing, Jiang, Yang, Yang, Yue-Ying, Gong, Bin-Sheng, Jiang, Wei, Zhang, Fan, Xiao, Yun, Wang, Qing K

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Electroacupuncture treatment of chronic insomniacs by Ruan, Jing-wen, Wang, Chu-huai, Liao, Xin-xue, Yan, Ying-shuo, Hu, Yue-hua, Rao, Zhong-dong, Wen, Ming, Zeng, Xiao-xiang, Lai, Xin-Sheng

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Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer by Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, Pinjala

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Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure by Da-Quan Yu, Tai Chong Chai, Meei Ling Thew, Yue Ying Ong, Rao, V.S., Leong Ching Wai, Lau, J.H.

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Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package by Ong, Y.Y., Vaidyanathan, K., Ho, S.W., Sekhar, V.N., Jong, M.C., Wai, L.C., Rao, V.S., Sheng, V., Ong, J., Ong, X., Zhang, X., Seung, Y.U., Lau, J., Lim, Y.K., Yeo, D., Chan, K.C., Yanfeng, Z., Tan, J.B., Sohn, D.K.

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