Search Results - Rebrassé, J.P.

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    Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing

    Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing by Aubert, A., Rebrassé, J.P., Dantas de Morais, L., Labat, N., Frémont, H.

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    Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections

    Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections by de Morais, L. Dantas, Allanic, F., Roqueta, F., Rebrasse, J.P.

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    Localization of sensitive areas of power AC switch under thermal laser stimulation

    Localization of sensitive areas of power AC switch under thermal laser stimulation by Debleds, S., Rebrasse, J.P., de Morais, L. Dantas, Frapreau, I., Perdreau, R., Morillon, B.

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