Search Results - Rejent, J.A

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  1. 1
    A methodology to establish baseline metrics for assessing the isothermally aging of Sn-Pb solder interconnects

    A methodology to establish baseline metrics for assessing the isothermally aging of Sn-Pb solder interconnects by Vianco, P.T, Rejent, J.A

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  2. 2
    Capillary Flow Solder Wettability Test

    Capillary Flow Solder Wettability Test by Vianco, P.T, Rejent, J.A

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  3. 3
    Properties of ternary Sn-Ag-Bi solder alloys. Part 1: Thermal properties and microstructural analysis

    Properties of ternary Sn-Ag-Bi solder alloys. Part 1: Thermal properties and microstructural analysis by Vianco, P.T., Rejent, J.A.

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  4. 4
    Properties of ternary Sn-Ag-Bi solder alloys. Part 2: Wettability and mechanical properties analyses

    Properties of ternary Sn-Ag-Bi solder alloys. Part 2: Wettability and mechanical properties analyses by Vianco, P.T., Rejent, J.A.

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  5. 5
    Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

    Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue by Vianco, P T, Burchett, S N, Neilsen, M K, Rejent, J A, Frear, D R

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  6. 6
    Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples

    Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples by Vianco, P.T., Stephens, J.J., Rejent, J.A.

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  7. 7
    Solder bond applications in a piezoelectric sensor assembly

    Solder bond applications in a piezoelectric sensor assembly by Vianco, P.T., Rejent, J.A.

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    Conference Proceeding
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