Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder by VIANCO, Paul T, REJENT, Jerome A, HLAVA, Paul F

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Properties of ternary Sn-ag-Bi solder alloys: Part I- Thermal properties and microstructural analysis by VIANCO, P. T, REJENT, J. A

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Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II: Aged condition by VIANCO, Paul T, REJENT, Jerome A, KILGO, Alice C

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Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder by VIANCO, Paul T, REJENT, Jerome A, KILGO, Alice C

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Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated Kovar substrates by LOPEZ, Edwin P, VIANCO, Paul T, REJENT, Jerome A

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Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy by Vianco, P T, Rejent, JA, Zender, G L, Hlava, P F

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Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part II. 63Sn-37Pb Alloy by Vianco, P T, Rejent, JA, Zender, G L, Hlava, P F

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Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-plated Kovar by LOPEZ, Edwin P, VIANCO, Paul T, REJENT, Jerome A

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Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue by Vianco, P T, Burchett, S N, Neilsen, M K, Rejent, J A, Frear, D R

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A methodology to establish baseline metrics for assessing the isothermally aging of Sn-Pb solder interconnects by Vianco, P.T, Rejent, J.A

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Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples by Vianco, P.T., Stephens, J.J., Rejent, J.A.

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Solder bond applications in a piezoelectric sensor assembly by Vianco, P.T., Rejent, J.A.

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