A test structure for contact and via failure analysis in deep-submicrometer CMOS technologies by Cabrini, A., Cantarelli, D., Cappelletti, P., Casiraghi, R., Maurelli, A., Pasotti, M., Rolandi, P.L., Torelli, G.

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Power efficient charge pump in deep submicron standard CMOS technology by Pelliconi, R., Iezzi, D., Baroni, A., Pasotti, M., Rolandi, P.L.

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A 1.2V-5V High Efficiency CMOS Charge Pump for Non-Volatile Memories by Richelli, Anna, Mensi, Luca, Colalongo, Luigi, Kovacs, Zsolt, Rolandi, Pier Luigi

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3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities by Fazzi, Alberto, Canegallo, Roberto, Ciccarelli, Luca, Magagni, Luca, Natali, Federico, Jung, Erik, Rolandi, Pier Luigi, Guerrieri, Roberto

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3D Contactless communication for IC design by Canegallo, R., Ciccarelli, L., Natali, F., Fazzi, A., Guerrieri, R., Rolandi, P.

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3D Capacitive Interconnections for High Speed Interchip Communication by Canegallo, R., Fazzi, A., Ciccarelli, L., Magagni, L., Natali, F., Rolandi, P.L., Jung, E., Di Cioccio, L., Guerrieri, R.

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64-min single-chip voice recorder/player using embedded 4bit/cell flash memory by Borgatti, Michele, Rocchi, Alessandro, Bisio, Marco, Besana, Monica, Navoni, Loris, Rolandi, Pier Luigi

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An analog associative memory chip for VQ image compression by Navoni, L., Besana, M., Rolandi, P.L.

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