Search Results - Rotaru, M.D.

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  1. 1
    Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

    Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards by Jingook Kim, Rotaru, M.D., Seungyong Baek, Jongbae Park, Iyer, M.K., Kim, Joungho

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  2. 2
    Design and Analysis of a Novel Compact High Permittivity Dielectric Resonator Antenna

    Design and Analysis of a Novel Compact High Permittivity Dielectric Resonator Antenna by Rotaru, M.D., Sykulski, J.K.

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  3. 3
    Three-dimensional system-in-package using stacked silicon platform technology

    Three-dimensional system-in-package using stacked silicon platform technology by Kripesh, V., Seung Wook Yoon, Ganesh, V.P., Khan, N., Rotaru, M.D., Wang Fang, Iyer, M.K.

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  4. 4
    Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

    Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs by Junwoo Lee, Rotaru, M.D., Iyer, M.K., Hyungsoo Kim, Kim, Joungho

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  5. 5
    A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices

    A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices by Jayabalan, J., Rotaru, M.D., Rao, V.S., Kripesh, V., Iyer, M.K., Tay, A.A.O., Ban-Leong Ooi, Mook-Seng Leong

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  6. 6
    High frequency characterization of 100 micron pitch wafer level package interconnects

    High frequency characterization of 100 micron pitch wafer level package interconnects by Jayabalan, J., Rotaru, M.D.

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  7. 7
    Numerical and experimental study of the effects of load and distance variation on wireless power transfer systems using magnetically coupled resonators

    Numerical and experimental study of the effects of load and distance variation on wireless power transfer systems using magnetically coupled resonators by Rotaru, M.D, Tanzania, R, Ayoob, R, Tan Yen Kheng, Sykulski, J.K

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  8. 8
    An integrated and compact ISM bandpass filter using combline structures

    An integrated and compact ISM bandpass filter using combline structures by Lim Ying Ying, Rotaru, M.D.

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  9. 9
    A compact and low cost multilayered balun designed for SiP applications

    A compact and low cost multilayered balun designed for SiP applications by Lim Ying Ying, Rotaru, M.D.

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  10. 10
    A Compact Integrated ISM Bandpass Filter Based on Combline Structures on Organic Substrate

    A Compact Integrated ISM Bandpass Filter Based on Combline Structures on Organic Substrate by Lim Ying Ying, Rotaru, M.D.

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  11. 11
    EMI simulation and measurements of multilayer structures for microprocessor packaging applications

    EMI simulation and measurements of multilayer structures for microprocessor packaging applications by Rotaru, M.D., Yang Rui, Nhon Do, Mechaik, M.

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  12. 12
    Radiation from arbitrary shape power/ground plane pair structure

    Radiation from arbitrary shape power/ground plane pair structure by Rui Yang, Rotaru, M.D., Kuruveettil, H., Pinjala, D., Iyer, M.K.

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  13. 13
    Coaxial probe dielectric measurements in the presence of airgaps

    Coaxial probe dielectric measurements in the presence of airgaps by Popov, A.P., Rotaru, M.D.

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  14. 14
    A novel integrated dielectric resonator antenna for circular polarization

    A novel integrated dielectric resonator antenna for circular polarization by Popov, A.P., Rotaru, M.D.

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  15. 15
    Design and evaluation of 4 channel full-duplex transceiver modules for optical communication applications

    Design and evaluation of 4 channel full-duplex transceiver modules for optical communication applications by Kuruveettil, H., Ramana, P.V., Rotaru, M.D., Zhao Zhiqiang, Chazelas, J.

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  16. 16
    Electrical characterization of a high performance microprocessor socket for system level simulation

    Electrical characterization of a high performance microprocessor socket for system level simulation by Rotaru, M.D., Wong Wui Weng

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  17. 17
    A model for efficient and improved measurements of the complex permittivity of thin organic packaging materials using open-ended coaxial line technique

    A model for efficient and improved measurements of the complex permittivity of thin organic packaging materials using open-ended coaxial line technique by Lim Ying Ying, Rotaru, M.D., Alphones, A., Popov, A.P., Rajoo, R.

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  18. 18
    Via and reference discontinuity impact on high-speed signal integrity

    Via and reference discontinuity impact on high-speed signal integrity by Jingook Kim, Kim, Joungho, Rotaru, M.D., Kok Chin Chong, Iyer, M.K.

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  19. 19
    Coupling of simultaneous switching noise to interconnecting lines in high-speed systems

    Coupling of simultaneous switching noise to interconnecting lines in high-speed systems by KIM, Jingook, MIHAI DRAGOS ROTARU, KOK CHIN CHONG, PARK, Jongbae, IYER, Mahadevan K, KIM, Joungho

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  20. 20
    Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multilayer PCBs

    Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multilayer PCBs by Junwoo Lee, Myunghoi Kim, Kim, Joungho, Rotaru, M.D., Iyer, M.K.

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