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Bondability, moldability, and reliability of very-long, multi-height Au bonding wires
by
Tok, C.W.
,
Rulloda, O.
,
Calpito, D.R.M.
,
Wulff, F.W.
,
Pasamanero, E.
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Conference Proceeding
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Conference Proceedings
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Bonding
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Engineering
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Engineering, Electrical & Electronic
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Engineering, Manufacturing
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Gold
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Integrated Circuit Interconnections
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Integrated Circuit Packaging
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Integrated Circuit Reliability
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Integrated Circuit Technology
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Linearity
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Maintenance Engineering
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Materials Science
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Materials Science, Multidisciplinary
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Science & Technology
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Shape Measurement
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Technology
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Wire
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Ieee Electronic Library (Iel) Conference Proceedings
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