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    Temporary 0-Level MEMS Packaging Using a Heat Decomposable Sealing Ring

    Temporary 0-Level MEMS Packaging Using a Heat Decomposable Sealing Ring by Bogaerts, L., Phommahaxay, A., Gerets, C., Jaenen, P., Van Hoof, R., S.Severi, De Coster, J., Beernaert, R., Rudra, S., Soussan, P., Witvrouw, A.

    Published in Procedia engineering
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